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Industrial ceramics in IC industry

IC integrated circuit


IC, also known as integrated circuit, has been 70 years since the birth of the first transistor in 1947. The development of half a century has promoted the road of modern intelligence. IC is mainly composed of three parts, electronic components, substrate and package shell.


The concern of these two pieces is not as high as that of electronic components, which may be due to the lack of technical content in the packaging and substrate. However, we may ignore the essence.


Industrial ceramics


The package and substrate are equivalent to the frame of the whole building, which is the rigid standard to determine the volume and area of IC. At present, there are only three kinds of government materials for packaging and substrate: plastic, metal and industrial ceramics. What we are going to talk about today is industrial ceramics.


Compared with the other two materials, ceramic substrate and ceramic package are the rising stars. However, the front waves of the Yangtze River push back the waves, and the front waves die on the beach. The popularization and application of industrial ceramics is much faster than that of plastics and metals. Industrial ceramics have unique advantages in both substrate and packaging fields.

Industrial ceramics in IC industry.jpg


At present, the power of electronic equipment is not the largest, but in a larger direction, so heat dissipation must be the first problem. If the heat dissipation problem is not solved, all ideas can only be on paper. For heat dissipation, industrial ceramics is the king in this field. Whether it is metal substrate or plastic substrate, the thermal conductivity coefficient is in single digit, while ceramic substrate is the best, The thermal conductivity of 170-230 can be achieved.


From the thermal expansion coefficient, the ceramic substrate will be closer to silicon, and the volume change at temperature is basically the same as that of electronic components, which will not lead to problems caused by thermal expansion and cold contraction. In the field of communication, the dielectric constant of industrial ceramics is very small, and the relative dielectric loss is also very small, and 5g is coming soon, which will lead to the craze for ceramic substrate in communication field.


IC is a very large piece, as for the future industrial ceramic materials can become a killer mace, or replace the other two materials, this is not known. But ceramics will dominate the IC industry.


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